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Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang.
Author
Hwang, Jennie S.
Published
New York : Van Nostrand Reinhold, c1989.
Call Number
TK7868.P7 H95s
Location
ห้องสมุดสำนักการเรียนรู้ตลอดชีวิตฯ

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